Title: Summary Part Bonding

Choose the correct statement.

- One basis for the classification of engineering materials is atomic bonding. (correct)
- One basis for the classification of engineering materials is elemental nature.
- One basis for the classification of engineering materials is the chemical behavior (reactive versus inert) of the respective elements.

- There are three kinds of strong, or primary, bonds responsible for the cohesion of solids. (correct)
- There are three kinds of strong bonds, called the strong forces, responsible for the cohesion of solids.
- There are four kinds of strong bonds responsible for the cohesion of solids.

- The ionic bond involves electron transfer and is nondirectional. The electron transfer creates a pair of ions with opposite charge, resulting in an attractive coulombic force between the pair and hence an atomic bond. (correct)
- The ionic bond involves electron sharing and is nondirectional. The sharing of electrons creates a bond.
- The ionic bond involves sharing of delocalized electrons, producing a non-directional bond.

- The covalent bond involves electron sharing between a pair of atoms and is highly directional. (correct)
- The covalent bond involves sharing of delocalized electrons, producing a non-directional bond.
- The covalent bond involves electron transfer and is highly directional.

- The metallic bond involves sharing of delocalized electrons, producing a non-directional bond. The resulting electron cloud or gas results in high electrical conductivity. (correct)
- The metallic bond involves transfer of electrons between pairs of metal atoms, producing a non-directional bond. The resulting 'hopping' electrons results in high electrical conductivity.
- The metallic bond involves no electron transfer. Yet, the intrinsically conductive properties of metal atoms results in high electrical conductivity.

- In the absence of electron transfer or sharing, a weaker form of bonding is possible. This secondary bonding is the result of attraction between either temporary (van der Waals forces) or permanent electrical dipoles. (correct)
- Secondary bonding is a weaker form of bonding. It also includes transfer or sharing of electrons, but the attraction between either temporary (van der Waals forces) or permanent electrical dipoles is pronouncedly weaker than that involved in primary bonds.

- Metals involve metallic bonding. (correct)
- Metals involve metallic and covalent bonding (both include sharing of electrons).
- Metals involve metallic and ionic bonding.

- Ceramics and glasses involve ionic bonding, but usually in conjunction with a strong covalent character. (correct)
- Ceramics and glasses involve ionic bonding with a pronounced non-directional character.
- Ceramics and glasses involve ionic and metallic bonding.

- Polymers typically involve strong covalent bonds along polymeric chains, but have weaker secondary bonding between adjacent chains. (correct)
- Polymers involve strong covalent bonds only.
- Polymers typically involve strong covalent bonds along polymeric chains, but have weaker ionic bonding between adjacent chains.

- In polymers, secondary bonds act as a weak links in the structure, giving characteristically low strengths and melting points. (correct)
- In polymers, the strong covalent bonds along the polymeric chains give characteristically high strengths and melting points.
- In polymers, ionic bonds between individual polymer chains giving characteristically low strengths and melting points.

- Semiconductors are predominantly covalent in nature, with some semiconducting compounds having a significant ionic character. (correct)
- Semiconductors are predominantly ionic in nature, with some semiconducting compounds having a significant metallic character.

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